400G/800G high-speed chips

During the 2023 CIOE, Xiamen SAN-U Optronics Co., Ltd. (referred to as SAN-U Optronics), a provider of high-speed semiconductor lasers/detectors and optical transceiver components, showcased a series of 25G/50G/100G optical devices and COB optical engine products, which are widely used in fields such as cloud computing, optical communication, fiber to the home, sensing and detection, and LiDAR. Dr. Li Ling, Chairman of Sanyou Optoelectronics, was interviewed by Xunshi Optical Communication Network on site. She stated that the company mainly exhibited three major application products, data communication, optical sensing, and airtight packaging, at this year's CIOE China Optical Expo, showcasing the leading intelligent manufacturing platform for optoelectronic devices in China. The products have received high-end attention from industry customers. In terms of data communication, SAN-U Optronics has successfully expanded its 400G/800G OEM services based on its existing high-speed optical engine technology product foundation. With the explosion of AI computing power connectivity in 2023, the demand for 800G optical communication has exceeded everyone's expectations. The entire industry is preparing sufficient materials for the delivery of 800G products, among which 400G/800G high-speed chips are still the most scarce key materials in the supply chain, bringing a new round of development opportunities for domestic optoelectronic chips. After more than 20 years of development, Sanyou Optoelectronics' optoelectronic chip packaging platform has been widely certified by the industry and customers. It can provide industry-leading chip packaging services and help accelerate the industrialization of domestic chips. In terms of optical sensing, SAN-U Optronics mainly researches and manufactures laser and MEMS sensor products. The company team has conducted in-depth research and development in this new field, and has achieved market breakthroughs in a series of products such as LiDAR, methane gas detection lasers/detectors, MEMS micro pump bio chip packaging and bio printing chip products, and fast detection chip products, receiving good customer feedback. In the context of weak traditional single market, the sensing market has provided strong performance support for the company. In addition, in terms of the application of airtight packaging technology, SAN-U Optronics has successfully introduced airtight packaging technology into the field of third-generation semiconductor materials, mainly in the new energy industry dominated by silicon carbide (SiC). With the prosperity of the new energy vehicle industry, silicon carbide has become the hottest semiconductor material, and related domestic silicon carbide materials and devices are rapidly rising.